Solid Edge Flow Simulation

For designing occupied space, including buildings and vehicles. It includes special simulation capabilities, including comfort parameters and tracer studies, an additional radiation model and an extended database for building materials.

For importing data from EDA software, including Siemens, Cadence, Zuken and Altium, as well as import of power and materials maps (SmartPCB) of printed circuit boards (PCBs) and definitions of thermal territories and network assemblies (Delphi model).

Specifically designed for Finite Element Analysis (FEA) of electronics cooling cases, leveraging the SmartPCB FE model; allows for a direct use of temperature and pressure loads from the CFD simulation all within one simulation run.

For simulation of low frequency electromagnetic effects of Alternating Current (AC) induced ohmic and iron losses, as well as permanent magnets and the direct coupled CFD simulation, in order to consider these losses in the thermal simulation of components such as transformers, bus bars and induction heaters.

For detailed simulation of electronics systems. It includes an extended database, packaging materials and physics such as joule heating.

For all lighting-specific simulations with the Monte Carlo radiation model, and a water film model for condensation and icing simulation of water films.

For multi-parameter optimizations leveraging the advanced HEEDS Sherpa solver; leverages multiple global and local search strategies and adapts the search as it learns more.

For more accurate thermal simulation of batteries with Equivalent Circuit Model (ECM) and Electrochemical-Thermal Coupled Model (ECT).

For the design of calibrated thermal semiconductor models from Simcenter T3STER measurements such as integrated circuits (ICs) and insulated gate bipolar transistors (IGBT).

For special applications such as hypersonic flow for up to Mach 30, orbital radiation simulation such as for satellites, the NIST real gas database and gas combustion simulation.

For extracting dynamic compact thermal models from a 3D model; thermal netlist extraction, for converting a 3D model into an electrothermal model for Simulation Program with SPICE; and package creator tool, for the rapid creation of thermal models of electronic packages. This module is comprised of the Boundary Condition Independent Reduced Order Model (BCI-ROM) feature.

The ultimate solution for electronics cooling, includes the BCI-ROM + Package Creator, EDA Bridge, Electronics Cooling and T2STER Automatic Calibration modules.