Solid Edge Flow Simulation

Simcenter FLOEFD for Solid Edge supports flow simulation with an embedded computational fluid dynamics (CFD) simulation tool for easy, fast and accurate fluid flow and heat transfer analysis.

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Front-loading CFD for engineering predictability

Fully embedded in Solid Edge, FLOEFD enables design engineers to front-load CFD, moving simulation early into the design process where it can help examine trends and eliminate less desirable design options.

Accurate, fast and easy-to-use fluid flow and heat transfer simulation

Used by engineers across the globe, FLOEFD technology offers answers to complex engineering problems quickly without sacrificing accuracy.

Fully integrated preprocessor, solver and post-processor

With FLOEFD you need only one fully integrated package to analyze your designs. Featuring automated meshing and robust convergence criteria, FLOEFD speeds up the overall design process.

Integrated parametric study and design comparison functionality

Understand influence of changes in the geometry or boundary conditions on the results by comparing a wide range of project variants. Assess results by numerical values, graphs or animations.

Digital “what if” analysis capabilities

Conduct “what if” analysis digitally with free surface flow simulation, lighting and radiation capabilities.

Instinctive user experience

An easy-to-use user interface (UI) offers considerable intelligent automation so it’s easy to use for the design engineer and powerful enough for the analysis specialist.


Available Add-on Modules


用于从西门子、Cadence、Zuken 和 Altium 等推出的 EDA 软件导入数据,以及导入印制电路板 (PCB) 的电源和材料图 (SmartPCB) 及热区域和热阻网络的定义(Delphi 模型)。

专门设计用于电子冷却箱的有限元分析 (FEA),运用 SmartPCB 有限元模型可以直接使用 CFD 仿真中的温度和压力载荷,所有这一切只需运行仿真一次即可。

用于对交流电 (AC) 感应欧姆和铁芯损耗进行低频电磁效应和永磁效应仿真以及直接耦合 CFD 仿真,从而考虑变压器、汇流条和感应加热器之类器件热仿真中的损耗。


For all lighting-specific simulations with the Monte Carlo radiation model, and a water film model for condensation and icing simulation of water films.

用于通过先进的 HEEDS Sherpa 求解器进行多参数优化,利用多个全局和本地搜索策略,并在详细了解之后调整搜索。

用于通过等效电路模型 (ECM) 和电化学-热偶模型 (ECT) 对电池进行更精确的热仿真。

用于根据 Simcenter T3STER 测量结果设计经过校准的热半导体模型,如集成电路 (IC) 和绝缘栅双极晶体管 (IGBT)。

用于各种特殊应用,例如马赫数高达 30 的高超声速流动、卫星轨道辐射仿真、NIST 实际气体数据库以及气体燃烧仿真等。

For extracting dynamic compact thermal models from a 3D model; thermal netlist extraction, for converting a 3D model into an electrothermal model for Simulation Program with SPICE; and package creator tool, for the rapid creation of thermal models of electronic packages. This module is comprised of the Boundary Condition Independent Reduced Order Model (BCI-ROM) feature.

为电子元件冷却提供最终解决方案,其中包括 BCI-ROM + 封装创建器模块、EDA 桥接模块、电子元件冷却模块以及 T2STER 自动校准模块。


Experience the power of Simcenter FLOEFD for Solid Edge

Best-in-class simulation capabilities in Solid Edge provide design engineers with powerful tools to help digitally validate their designs to build better products in less time by front-loading the simulation process

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