{"id":320,"date":"2024-10-23T09:01:44","date_gmt":"2024-10-23T13:01:44","guid":{"rendered":"https:\/\/solidedge.siemens.com\/?page_id=320"},"modified":"2025-02-05T12:39:01","modified_gmt":"2025-02-05T17:39:01","slug":"solid-edge-flow-simulation","status":"publish","type":"page","link":"https:\/\/solidedge.siemens.com\/en\/solutions\/products\/simulation\/solid-edge-flow-simulation\/","title":{"rendered":"Solid Edge Flow Simulation"},"content":{"rendered":"

[vc_row full_width=”stretch_row” full_height=”yes” content_placement=”middle” css=”.vc_custom_1643022676647{background: #a6a6a6 url(https:\/\/solidedge.siemens.com\/wp-content\/uploads\/2022\/01\/dsc1685-sehero-1920×873-1.jpg?id=57328) !important;background-position: center !important;background-repeat: no-repeat !important;background-size: cover !important;}” el_class=”vc-row-hero-banner”][vc_column][vc_column_text el_class=”.vc-el-callout”]<\/p>\n

Solid Edge Flow Simulation<\/h1>\n

Simcenter FLOEFD for Solid Edge supports flow simulation with an embedded computational fluid dynamics (CFD) simulation tool for easy, fast and accurate fluid flow and heat transfer analysis.
\n<\/i>Solid Edge free trial<\/a>[\/vc_column_text][\/vc_column][\/vc_row][vc_row full_width=”stretch_row” equal_height=”yes” el_class=”more-info-bluebox” css=”.vc_custom_1717694979611{margin-top: 0px !important;margin-bottom: 0px !important;padding-top: 0px !important;padding-bottom: 0px !important;background-color: #006486 !important;}”][vc_column css=”.vc_custom_1556640873153{margin-top: 0px !important;margin-bottom: 0px !important;padding-top: 0px !important;padding-bottom: 0px !important;}”][vc_column_text css=”.vc_custom_1738777135558{margin-top: 0px !important;margin-bottom: 0px !important;padding-top: 1em !important;padding-bottom: 1em !important;}”]<\/p>\n

For a limited time, get 30% off Solid Edge simulation products<\/i>See details<\/a><\/span><\/span><\/div>\n

[\/vc_column_text][\/vc_column][\/vc_row][vc_row full_width=”stretch_row” css=”.vc_custom_1524688447733{background-color: #ebf0f6 !important;}”][vc_column][vc_column_text el_class=”vc-el-lead-in”]Capabilities<\/p>\n

Front-loading CFD for engineering predictability<\/h2>\n

Fully embedded in Solid Edge, FLOEFD enables design engineers to front-load CFD, moving simulation early into the design process where it can help examine trends and eliminate less desirable design options.[\/vc_column_text][vc_row_inner el_class=”vc-row-image-teasers”][vc_column_inner width=”1\/3″][vc_column_text]<\/p>\n

Accurate, fast and easy-to-use fluid flow and heat transfer simulation<\/h3>\n

Used by engineers across the globe, FLOEFD technology offers answers to complex engineering problems quickly without sacrificing accuracy.[\/vc_column_text][\/vc_column_inner][vc_column_inner width=”1\/3″][vc_column_text]<\/p>\n

Fully integrated preprocessor, solver and post-processor<\/h3>\n

With FLOEFD you need only one fully integrated package to analyze your designs. Featuring automated meshing and robust convergence criteria, FLOEFD speeds up the overall design process.[\/vc_column_text][\/vc_column_inner][vc_column_inner width=”1\/3″][vc_column_text]<\/p>\n

Integrated parametric study and design comparison functionality<\/h3>\n

Understand influence of changes in the geometry or boundary conditions on the results by comparing a wide range of project variants. Assess results by numerical values, graphs or animations.[\/vc_column_text][\/vc_column_inner][vc_column_inner width=”1\/3″][vc_column_text]<\/p>\n

High-speed, automatic meshing technology<\/h3>\n

Automate your meshing process with SmartCells Technology and cartesian mesh generator in FLOEFD, resulting in 2-3 times faster meshing speed.[\/vc_column_text][\/vc_column_inner][vc_column_inner width=”1\/3″][vc_column_text]<\/p>\n

Digital \u201cwhat if\u201d analysis capabilities<\/h3>\n

Conduct \u201cwhat if\u201d analysis digitally with free surface flow simulation, lighting and radiation capabilities.[\/vc_column_text][\/vc_column_inner][vc_column_inner width=”1\/3″][vc_column_text]<\/p>\n

Instinctive user experience<\/h3>\n

An easy-to-use user interface (UI) offers considerable intelligent automation so it\u2019s easy to use for the design engineer and powerful enough for the analysis specialist.[\/vc_column_text][\/vc_column_inner][\/vc_row_inner][vc_column_text]<\/p>\n

<\/i>Download the Simcenter FLOEFD for Solid Edge data sheet<\/a><\/p>\n

[\/vc_column_text][\/vc_column][\/vc_row][vc_row el_class=”vc-row-accordion” css=”.vc_custom_1632241664989{margin-bottom: 0px !important;border-bottom-width: 0px !important;padding-bottom: 0px !important;}”][vc_column][vc_column_text el_class=”vc-el-lead-in”]Modules<\/p>\n

Available Add-on Modules<\/h2>\n

[\/vc_column_text][vc_tta_accordion style=”flat” shape=”square” active_section=”0″ no_fill=”true” collapsible_all=”true” el_class=”vc-el-accordion” css=”.vc_custom_1632156005911{margin-bottom: 0px !important;border-bottom-width: 0px !important;padding-bottom: 0px !important;}”][vc_tta_section title=”Heating, Ventilation and Air Conditioning (HVAC)” tab_id=”01″][vc_row_inner][vc_column_inner width=”1\/2″][vc_column_text]For designing occupied space, including buildings and vehicles. It includes special simulation capabilities, including comfort parameters and tracer studies, an additional radiation model and an extended database for building materials.[\/vc_column_text][\/vc_column_inner][vc_column_inner width=”1\/2″][vc_single_image image=”57286″ img_size=”full”][\/vc_column_inner][\/vc_row_inner][\/vc_tta_section][vc_tta_section title=”EDA Bridge” tab_id=”02″][vc_row_inner][vc_column_inner width=”1\/2″][vc_column_text]For importing data from EDA software, including Siemens, Cadence, Zuken and Altium, as well as import of power and materials maps (SmartPCB) of printed circuit boards (PCBs) and definitions of thermal territories and network assemblies (Delphi model).[\/vc_column_text][\/vc_column_inner][vc_column_inner width=”1\/2″][vc_single_image image=”57358″ img_size=”full”][\/vc_column_inner][\/vc_row_inner][\/vc_tta_section][vc_tta_section title=”Structural” tab_id=”03″][vc_row_inner][vc_column_inner width=”1\/2″][vc_column_text]Specifically designed for Finite Element Analysis (FEA) of electronics cooling cases, leveraging the SmartPCB FE model; allows for a direct use of temperature and pressure loads from the CFD simulation all within one simulation run.[\/vc_column_text][\/vc_column_inner][vc_column_inner width=”1\/2″][vc_single_image image=”57371″ img_size=”full”][\/vc_column_inner][\/vc_row_inner][\/vc_tta_section][vc_tta_section title=”Electromagnetics (EMAG)” tab_id=”1642784106182-2237f16a-a6ac”][vc_row_inner][vc_column_inner width=”1\/2″][vc_column_text]For simulation of low frequency electromagnetic effects of Alternating Current (AC) induced ohmic and iron losses, as well as permanent magnets and the direct coupled CFD simulation, in order to consider these losses in the thermal simulation of components such as transformers, bus bars and induction heaters.[\/vc_column_text][\/vc_column_inner][vc_column_inner width=”1\/2″][vc_single_image image=”57384″ img_size=”full”][\/vc_column_inner][\/vc_row_inner][\/vc_tta_section][vc_tta_section title=”Electronics Cooling” tab_id=”1642784189189-965db2ce-2867″][vc_row_inner][vc_column_inner width=”1\/2″][vc_column_text]For detailed simulation of electronics systems. It includes an extended database, packaging materials and physics such as joule heating.[\/vc_column_text][\/vc_column_inner][vc_column_inner width=”1\/2″][vc_single_image image=”57397″ img_size=”full”][\/vc_column_inner][\/vc_row_inner][\/vc_tta_section][vc_tta_section title=”Light-Emitting Diode (LED)” tab_id=”1642784231262-e6f4093d-0984″][vc_row_inner][vc_column_inner width=”1\/2″][vc_column_text]For all lighting-specific simulations with the Monte Carlo radiation model, and a water film model for condensation and icing simulation of water films.[\/vc_column_text][\/vc_column_inner][vc_column_inner width=”1\/2″][vc_single_image image=”57842″ img_size=”full”][\/vc_column_inner][\/vc_row_inner][\/vc_tta_section][vc_tta_section title=”Extended Design Exploration” tab_id=”1642784266984-d2560e70-246c”][vc_row_inner][vc_column_inner width=”1\/2″][vc_column_text]For multi-parameter optimizations leveraging the advanced HEEDS Sherpa solver; leverages multiple global and local search strategies and adapts the search as it learns more.[\/vc_column_text][\/vc_column_inner][vc_column_inner width=”1\/2″][vc_single_image image=”57436″ img_size=”full”][\/vc_column_inner][\/vc_row_inner][\/vc_tta_section][vc_tta_section title=”Power Electrification” tab_id=”1642784309950-be9a6caf-0b89″][vc_row_inner][vc_column_inner width=”1\/2″][vc_column_text]For more accurate thermal simulation of batteries with Equivalent Circuit Model (ECM) and Electrochemical-Thermal Coupled Model (ECT).[\/vc_column_text][\/vc_column_inner][vc_column_inner width=”1\/2″][vc_single_image image=”57449″ img_size=”full”][\/vc_column_inner][\/vc_row_inner][\/vc_tta_section][vc_tta_section title=”T3STER Auto Calibration” tab_id=”1642784336394-98ed174c-2545″][vc_row_inner][vc_column_inner width=”1\/2″][vc_column_text]For the design of calibrated thermal semiconductor models from Simcenter T3STER measurements such as integrated circuits (ICs) and insulated gate bipolar transistors (IGBT).[\/vc_column_text][\/vc_column_inner][vc_column_inner width=”1\/2″][vc_single_image image=”57462″ img_size=”full”][\/vc_column_inner][\/vc_row_inner][\/vc_tta_section][vc_tta_section title=”Advanced CFD” tab_id=”1642784380402-0519cd8c-17b0″][vc_row_inner][vc_column_inner width=”1\/2″][vc_column_text]For special applications such as hypersonic flow for up to Mach 30, orbital radiation simulation such as for satellites, the NIST real gas database and gas combustion simulation.[\/vc_column_text][\/vc_column_inner][vc_column_inner width=”1\/2″][vc_single_image image=”57855″ img_size=”full”][\/vc_column_inner][\/vc_row_inner][\/vc_tta_section][vc_tta_section title=”BCI ROM + Package Creator” tab_id=”1642784402943-472d97f2-fb7d”][vc_row_inner][vc_column_inner width=”1\/2″][vc_column_text]For extracting dynamic compact thermal models from a 3D model; thermal netlist extraction, for converting a 3D model into an electrothermal model for Simulation Program with SPICE; and package creator tool, for the rapid creation of thermal models of electronic packages. This module is comprised of the Boundary Condition Independent Reduced Order Model (BCI-ROM) feature.[\/vc_column_text][\/vc_column_inner][vc_column_inner width=”1\/2″][vc_single_image image=”57488″ img_size=”full”][\/vc_column_inner][\/vc_row_inner][\/vc_tta_section][vc_tta_section title=”Electronics Cooling Center” tab_id=”1642784432354-84b30cdf-92f8″][vc_row_inner][vc_column_inner width=”1\/2″][vc_column_text]The ultimate solution for electronics cooling, includes the BCI-ROM + Package Creator, EDA Bridge, Electronics Cooling and T2STER Automatic Calibration modules.[\/vc_column_text][\/vc_column_inner][vc_column_inner width=”1\/2″][vc_single_image image=”57501″ img_size=”full”][\/vc_column_inner][\/vc_row_inner][\/vc_tta_section][\/vc_tta_accordion][\/vc_column][\/vc_row][vc_row full_width=”stretch_row” el_class=”vc-row-video-highlight”][vc_column][vc_column_text el_class=”vc-el-lead-in”]Video<\/p>\n

Experience the power of Simcenter FLOEFD for Solid Edge<\/h2>\n

Best-in-class simulation capabilities in Solid Edge provide design engineers with powerful tools to help digitally validate their designs to build better products in less time by front-loading the simulation process<\/span><\/p>\n

See More Videos<\/a><\/p>\n

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